Joint initiative for automotive chiplet technology
CHASSIS: European mobility, semiconductor, and software heavyweights team up with research in joint initiative for automotive chiplet technology
The CHASSIS initiative represents a strategic leap forward in automotive compute platform design for Software-Defined Vehicles (SDVs). The project focuses primarily on pioneering chiplet-based architectures to overcome the limitations of traditional monolithic System-on-Chips (SoCs). Ultimately, we aim to redefine how automotive electronics are developed, integrated, and deployed across vehicle segments.
Our mission is to enable scalable, high-performance computing platforms for SDVs through innovative chiplet-based architectures. By introducing a flexible, modular approach to semiconductor design, CHASSIS aims to empower automotive manufacturers with tailored solutions, accelerate the transition to software-defined mobility, and foster competitive innovation within the industry.
CHASSIS envisions a future where European technological sovereignty in automotive semiconductor innovation is restored and secured. We are working to build a multi-vendor chiplet ecosystem that offers unparalleled architectural flexibility and ensures readily available, automotive-grade compute platforms, free from the constraints of proprietary solutions and consumer electronics-focused SoCs
CHASSIS is making a profound impact by enabling scalable compute architectures that meet diverse performance needs and thus accelerating the shift to software-defined mobility. We are fostering competitive innovation by opening up the high-performance compute market, ensuring architectural flexibility for E/E designs, and ultimately solidifying Europe’s position at the forefront of advanced automotive computing.
The core of the chiplet ecosystem will simplify integration and provide OEMs with greater flexibility.
Early hardware/software co-validation will accelerate development and reduce risk.
Demonstrates true interoperability, which will eliminate vendor lock-in and foster collaboration.
Comprising multiple chiplets, this packaged SoC will demonstrate the viability of automotive chiplets, thus building confidence in the technology and driving industry-wide adoption.
Purpose-built for safety-critical SDVs, it will ensure compliance and reliability.
Real-world validation that builds trust and showcases readiness for deployment in series vehicles.
CHASSIS: European mobility, semiconductor, and software heavyweights team up with research in joint initiative for automotive chiplet technology
The project team comprises European heavyweights from industry and research.
This diversity brings a wealth of perspectives and expertise to the project.
The project partners include 3 major OEMs, 1 automotive supplier, 7 semiconductor
and 2 software players, 1 EDA technology provider, as well as 4 research institutions
Contact the CHASSIS project team to discuss the project, our partners or mission.